This New Android Flagship Chip Enables Bluetooth Connectivity Up to 15 Kilometers – Android Authority

MediaTek has introduced the Dimensity 9400 Plus, an enhanced version of its flagship processor launched last year. This new chip features significant performance, AI, and connectivity improvements compared to the standard Dimensity 9400. The first smartphones equipped with the Dimensity 9400 Plus are anticipated to debut later this month. While the Dimensity 9400 Plus retains many similarities to its predecessor, notable enhancements include a remarkable increase in Bluetooth range, now extending to 15 kilometers (9.3 miles) for phone-to-phone connections, compared to the previous 1.5 kilometers.

This long-distance Bluetooth capability is already being adopted by brands like vivo, OPPO, and OnePlus, highlighting the potential applications of this technology. Performance-wise, the Dimensity 9400 Plus features a 100MHz boost in clock speed for its Cortex-X925 big CPU core, increasing from 3.63GHz to 3.73GHz. The other cores remain unchanged, retaining their existing frequencies. This results in a modest improvement in single-core performance.

Also, the chipset continues using the NPU 890 AI silicon but introduces Speculative Decoding Plus (SpD+) support, which enhances agentic AI performance by up to 20%. In addition to these upgrades, the Dimensity 9400 Plus supports low-voltage batteries, potentially extending battery life or allowing for lighter device designs. Improved BeiDou satellite support offers a 33% faster time to first fix, further advancing its capabilities. Other features remain consistent with the Dimensity 9400, including an Arm Immortalis-G925 MC12 GPU, a Release 17 5G modem, and advanced camera technologies.

While it may not surpass the Snapdragon 8 Elite in peak CPU performance, the Dimensity 9400 Plus is expected to excel in sustained graphical performance, making it an excellent choice for gamers. The first devices featuring this new chip will be available later this month, with more details on availability in the U.S. expected later this year.

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